Tuesday, 2 February 2016

LeEco Le Max Pro with Snapdragon 820 gets TENAA approval


LeEco (formerly known ad LeTV) introduced first Snapdragon 820 powered smartphone, the LeMax Pro at CES 2016 Las Vegas. It was just a formal introduction, with the actual launch taking place later this year. Now, the Le Max Pro has received approval from Chinese telecommunications certification authority, TENAA, which means that we can expect the device to launch soon in China.

 Additionally, the Le Max Pro comes with Qualcomm's Sense ID Fingerprint technology, Qualcomm Quick Charge 2.0 for up to 75% faster charging, 802.11ad multi-giagabit WiFi and X12 LTE with Cat. 12/13 download speed of up to 600mbps.

 We already know that, apart from Snapdragon 820 and its features, the rest of the specs of Le Max Pro will be identical as the Le Max, that was introduced last year, and TENAA listing confirms this. The LeMax Pro specs include 6.33-inch Quad HD display, 4G RAM, 64GB storage, 21-megapixel Sony IMX230 rear camera, 4 Ultrapixel front camera, NFC, USB Type-C and a 3400mAh battery.

As for the pricing, according to earlier rumors, the Le Max Pro is expected to be priced at CNY 3,500 ($535 | Rs. 35,000).

LeTV Le Max Pro specifications
  • Display: 6.33-inch (2560 x 1440 pixels) Quad HD display
  • Processor: Quad-Core Snapdragon 820 64-bit processor with Adreno 530 GPU
  • RAM and Storage: 4GB DDR4 RAM, 64GB internal storage
  • Camera:21MP rear camera with dual-tone LED flash, Sony IMX230 Sensor, OIS, f/2.0 aperture, dual ISP support | 4-UltraPixel front-facing camera with OmniVision OV4688 sensor, 81.6-degree wide-angle lens
  • OS: Android 6.0 Marshmallo based EUI
  • Connectivity: Dual SIM, 4G LTE with VoLTE, 802.11ad 2×2 MU-MIMO, Tri-band Wi-Fi, Bluetooth 4.1 with APT-X, GPS, NFC, MHL 3.0, USB Type-C, Wireless HDMI
  • Battery: 3400mAh
  • Dimensions: 167.1 × 83.5 × 8.95mm | Weight: 204g
  • Others: Fingerprint reader with Qualcomm Sense ID, LeHiFi and audio chip built by AKG, Qualcomm QuickCharge 2.0

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