LeEco Le 2 Pro (X820) with Snapdragon 820 SoC, 6GB RAM spotted on GFXBench

If various benchmarks and TENAA listing are true, the successor of LeEco's Le 1s, is reportedly coming in several models. Earlier this month the Le 2 with 5.5-inch display, Helio X20 SoC, 3GB RAM, 32GB storage and 16MP & 8MP was spotted on TENAA, and now a new Le 2 variant code-named X820 reportedly called Le 2 Pro has surfaced on Geekbench and GFXbench benchmarks, outing the specs.

According to the benchmark results, the Le 2 Pro will pack top of the line specs, which includes 5.5-inch QHD display, Snapdragon 820 SoC w/ Adreno 530 GPU, 6GB RAM, 64GB storage, 21MP rear camera (w/ LED flash, 4K video recording) and 8-megapixel front camera (w/ 2K video recording). The Le 2 Pro will have a fingerprint scanner, support 4G LTE, USB Type-C, fueled by a 3100mAh battery and run Android 6.0.1 Marshmallow.

Last month, another Le 2 variant code named X625 surfaced on GFXBench with Helio X25 SoC w/ 3GB RAM, and a Snapdragon 625 SoC w/ 3GB RAM powered model on AnTuTu. There is one more model with 5.7-inch QHD display, Snapdragon 820 SoC and 4GB RAM.

To recall, LeEco's, first smartphone, Le One came in three models, and the Le 2 variants popping up on various places, could mean the LeEco has planned a similar strategy for the Le 2. 

If this is true we can expect three LeEco Le 2models - the standard Le 2 (5.5-inch 1080p display, MediaTek Helio X20 SoC, 3GB RAM), Le 2 Pro (5.5-inch QHD display, Snapdragon 820 SoC, 6GB RAM) and Le 2 Max (5.7-inch QHD display, Snapdragon 820 SoC and 4GB RAM). The Helio X25 SoC model could be ditched, because the SoC is exclusive to Meizu's Pro 6, that's what MediaTek said. The question mark is over the Snapdragon 625 powered model, could this be a Lite variant?

We will not have to wait much longer to know that, as, LeEco has scheduled an event in China tomorrow April 20, and we can expect the announcement of the Le 2 family. Also it is being reported that the brand will also announce its foray into the U.S market. 

Via