Wednesday, 8 February 2017

MediaTeks's Helio P25 octa-core chip brings dual-camera support to mid-range smartphones

MediaTek has officially announced the Helio P25 SoC for smartphones in China. The new chip has been designed using 16nm fabrication process to deliver up to 25 percent better power efficiency. The chip's main focus is to bring dual-camera system to mid-range smartphone to offer premium quality imaging and high-end camera feature.

The Helio P25 features an octa-core ARM Cortex A53 chop clocked at up to 2.5GHz, mated to an ARM Mali T880 GPU clocked at 900MHz. It can support up to 6GB RAM and Cat.6 LTE connectivity.

For imaging capabilities, the new Helio P25 chip has MediaTek Imagiq to deliver superior Image Signal Processor (ISP) technology same as Helio P20. It supports camera sensors with up to 24MP single camera or 13MP + 13MP dual rear cameras, up to 4K video recording, depth-of-field lenses, high performance auto exposure, bokeh effect, video HDR with full preview and Turbo 3A to accelerate AE convergence speeds by up to 55 percent. 

“MediaTek Helio P25 puts advanced camera effects at user fingertips, including shallow depth-of-field – typically associated more expensive lenses – and high performance auto exposure that lets users capture the highest quality images in any lighting scenario,” said the company. “Supporting two cameras up to 13MP each, the MediaTek Helio P25 redefines expectations for mobile photography and our multimedia features like, MediaTek MiraVision technology, continuously enhance visual user-experiences.” MediaTek added.

Smartphones powered by MediaTek Helio P25 chip are expected to be available in the first quarter of this year. 


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