MediaTek is well know for making chips for affordable and mid-range smartphone. But now the company is launching a module designed for health monitoring: MediaTek Sensio MT6381. The MediaTek Sensio MT6381 is a 6-in-1 smartphone biosensor module and can track heart rate, blood pressure trends, pheripherals oxygen saturation levels and more. In other words the module is a hardware and software solution that can be easily embedded into a smartphone to allow users to track the following health data using their smartphone:
Heart-rate – measures heart beats per minute.
Heart-Rate Variability – measures variation in the time between heartbeats.
Blood Pressure Trends – measures blood pressure trends so users can see a range of data over a period of time.
Peripheral Oxygen Saturation (SpO2) – measures the amount of oxygen in the blood.
Electrocardiography (ECG) – measures the electrical activity of the heart over a period of time and displays it in graph form.
Photoplethysmography (PPG) – measures the change in volume of blood.
The module uses LEDs in conjunction with a light sensitive sensor to measure the absorption of red and infrared light by the user’s fingertips. Note that light sensitive sensors will be placed in three separate areas on your smartphone (one at the rear and two on the side), and you'll have to place your fingertips on each of them simultaneously to get an accurate reading.
By touching the sensors and electrodes with your fingertips, the module creates a closed loop between your heart and the biosensor to measure ECG and PPG waveforms. MediaTek says that the module can deliver the readings of the six health data to the users in about 60 seconds, which will be synced to an app. Samsung already allows heart rate monitoring on their flagship product. It debut in Galaxy S5, and the models after that till Galaxy S8 and Galaxy Note8 also comes with the sensor. But with Sensio module, you'll be able to get more health data with a tap on the sensor. The Sensio MT6381 will be made available to MediaTek partners in early 2018.
Chip makers Qualcomm and MediaTek has announced their support for Google's Android Oreo (Go Edition). To remind you the lighter Android operating system was launched at an event in India earlier this week, and is designed to run on low-cost Android devices that have up to 1GB RAM. Qualcomm said that it is working with Google to deliver an optimal experience on devices with less than 1GB RAM with the Android Oreo (Go Edition). Its mid and low-tier Snapdragon mobile platforms will be ready to be used by device manufacturers shortly after the latest version of Android is released to the Open Source Project. This will enable the next wave of value priced smartphones with a focus on speed and reliability. Mediatek on the other hand said that after its deep collaboration with Google, MediaTek's MT6739, MT6737 and MT6580 processor are optimized and support packages are available to run Android Oreo (Go Edition). Limited processing power and storage are top pain points for entry-level device users. Android Oreo (Go edition) was created to not only address these issues, but also to deliver 15% faster performance, security, data management, and 2x more storage. With Android Oreo (Go edition), Google has also optimized its services and Google Play Store to improve the capabilities of entry-level devices. The Go Edition also comes with a suite of light-weight apps such as Google Go, YouTube Go, Google Assistant Go, Google Maps Go, Gmail Gi and Files Go. Android Oreo (Go edition) is expected to be available running on devices based on Snapdragon and MediaTek mobile platforms in early 2018. Source 1 | 2
MediaTek has announced that it has become the first system-on-chip (SoC) maker to join Google Express, a program designed to provide device makers with certified Android software solutions quicker, including Google Mobile Services and Google Compatibility Test Suite (CTS) certification. Under the program, budget device makers (OEM & ODM) utilizing MediaTek SoC, will be able to get a pre-tested, pre-certified and fully compliant build of Android and GMS. This will help them deliver a secure, first-class Android experience to their customers. As a result device makers will be able to reduce the typical compatibility certification process from three months to four weeks. Moreover customers will also receive frequent security patches to reduce risks of device hacking. According to Mediatek, its chipsets power more than 1.5 billion devices a year across a broad range of products including smartphones, TVs, voice assisted devices, routers and more. As GMS Express' first SoC partner, MediaTek can help device makers get to market more cost effectively and faster and ensure high-quality, consistent consumer experiences with Android apps and devices. Source
MediaTek at the ongoing MWC 2017, New Delhi, has announced a new mobile chipset MT6739 designed for mid- to entry-level 4G smartphone. The Taiwan based chip maker says MediaTek MT6739 "delivers a package of superior features for entry-4G smartphone users in India" The MediaTek MT6739 is a quad-core 64-bit chip with four ARM Cortex-A53 CPU cores and operates up to 1.5GHz. The graphics will be handled by IMG PowerVR GE8100 GPU. The new processor also supports premium smartphone features like dual-camera photography and handle HD+ resolution (1400 x 720 pixels) with 18:9 aspect ratio, allowing smartphone makers to manufacture bezel-less phones. This means both the current trending features will show up on even more affordable smartphones. It also packs future-proof cellular technology. It features an advanced WorldMode LTE Cat.4 modem, and supports dual VoLTE and Dual SIM Dual Standby with either 4G+4G (L+L) or 4G+3G (L+W). MediaTek MT6739 other features
Up to 3GB LPDDR3 (667MHz) RAM
eMMC 5.1 storage
1080p, 30fps video playback, H.265 and legacy H.264
1080p, 30fps H.264 video recording
13MP camera image signal processor with Faster NR, AF, Luma/Chroma Noise Reduction, Native dual camera function
MediaTek has introduced the new member of the Helio chipset family: Helio P23 and Helio P30. The processors designed for mid-range smartphone, and offers performance and power efficiency, dual-cameras and world's first dual-SIM with dual 4G VoLTE capabilities. Both are octa-core processors with eight ARM Cortex A53 cores operating up to 2.3GHz, and are manufactured using TSMC 16nm FinFET production process. The Helio P23 packs Mali G71 MP2 GPU clocked at 770MHz, while the Helio P30 also packs Mali G71 MPS GPU, but is clocked at 950MHz. For memory, both chipsets supports up to 6GB LPDD4X RAM clocked at 1.6GHz. They also include MediaTek's CorePilot 4.0 technology that helps in power aware scheduling, thermal management and UX monitoring.
For photography, both support dual-cameras. The Helio P23 supports dual 13MP camera setup or a single 24MP sensor, while the Helio P30 supports up to dual 16MP camera setup. They also boast MediaTek's Imagiq 2.0 technology for better photography, while minimizing aliasing, grain and noise, and reduce chromatic aberration, resulting in clear, crisp, high-quality images even in low-light conditions. They are also equipped with CCU (camera control unit) technology, which offers "auto exposure convergence speed up to twice as fast as competitors". As an addition, the P30 gets a new Vision Processing Unit (VPU), a dedicated 500MHz digital signal processor paired to Image Signal processor. They work together, and free up system resources and deliver performance boost, programmability & flexibility (allows OEMs to customize camera functions), power reduction and real-time image and video bokeh. For connectivity, both gets MediaTek's latest generation 4G LTE WorldMode modem with a unique combination of Cat-7/13 speeds at 300Mbps download and 150Mbps upload. The Helio P23 also gets world's first dual SIM, dual 4G VoLTE/ViLTE support, which means dual-SIM smartphones will support 4G VoLTE on both primary and secondary SIM. The MediaTek Helio P23 SoC will be available globally in Q4 2017 and the MediaTek Helio P30 SoC will launch first in China at the same time. Source
MediaTek in collaboration with China Mobile has introduced 'Dual 4G VoLTE solution'. Currently 4G smartphones allow only the primary SIM card to support VoLTE, while the secondary SIM card can only use 2G/3G. But the Dual 4G VoLTE solution will allow dual-SIM smartphones to support 4G VoLTE with both primary and secondary SIM card, instead of just primary. MediaTek's Helio X30 will be the first chipset to utilize the Dual 4G VoLTE solution, and it is highly integrated and optimized within the chip. For those unaware, VoLTE is a 4G LTE net-work based HD voice technology for high-speed wireless voice and video calling over 4G network. Compared to 2G/3G networks, VoLTE calls and video calling offer higher audio and visual quality. MediaTek says, Dual 4G VoLTE solution will maximize the usability of dual VoLTE with stable calling quality and high data transfers to deliver a better Internet and calling experiences. Source
MediaTek's Helio X30 is a 10nm chip with deca-core processor. It was announced back in September 2016, and now at MWC 2017, in Barcelona, MediaTek has announced that the Helio X30 is entering mass production. The Helio X30 utilises MediaTek's 10-core Tri clusture architecture, and is the company's first 10nm chipset, that promises 35 percent increase in performance, and more than 50 percent power saving, compared to Helio X20. The deca-core CPU features two high performance ARM Cortex A73 cores at 2.5GHz; four lower power ARM Cortex-A53 cores at 2.2 GHz and four energy efficient ARM Cortex-A35 cores at 1.9GHz. It supports up 8GB LPDDR4X RAM and is embedded with LTE WorldMode Cat.10 for seamless and reliable connectivity and supports three downlink Carrier Aggregation (3CA) with performance of 400MB/s and two uplink Carrier Aggregation (2CA) with 150MB/s. For graphics, the Helio X30 packs PowerVR Series7XT Plus GPU clocked at 800MHz, and offers power savings up to 60 percent, while increasing performance by up to 2.4 times than its previous platform. It also supports major commercial VR SDKs. The Helio X30 is the first mobile chip, to bring hardware based 4K2K 10-bit HDR10 video decoding to smartphones for a true-to-life viewing experience. It also features CorePilot 4.0 for intelligent task scheduling system, thermal manage and system monitoring to control power consumption, as a result delivering enhanced battery back up. The chip incorporates two 14-bit ISPs (image signal processors) supporting 16MP + 16MP dual cameras, for advanced functionality such as wide + zoom combination lenses for real-time depth of field effects, fast auto-exposure and better images in low-light conditions. It also has Imagiq's dual camera zoom for 2x optical zoom in a super slim form factor. MediaTek says that smartphones powered by Helio X30 chip will be available in Q2 2017.
MediaTek has officially announced the Helio P25 SoC for smartphones in China. The new chip has been designed using 16nm fabrication process to deliver up to 25 percent better power efficiency. The chip's main focus is to bring dual-camera system to mid-range smartphone to offer premium quality imaging and high-end camera feature. The Helio P25 features an octa-core ARM Cortex A53 chop clocked at up to 2.5GHz, mated to an ARM Mali T880 GPU clocked at 900MHz. It can support up to 6GB RAM and Cat.6 LTE connectivity. For imaging capabilities, the new Helio P25 chip has MediaTek Imagiq to deliver superior Image Signal Processor (ISP) technology same as Helio P20. It supports camera sensors with up to 24MP single camera or 13MP + 13MP dual rear cameras, up to 4K video recording, depth-of-field lenses, high performance auto exposure, bokeh effect, video HDR with full preview and Turbo 3A to accelerate AE convergence speeds by up to 55 percent. “MediaTek Helio P25 puts advanced camera effects at user fingertips, including shallow depth-of-field – typically associated more expensive lenses – and high performance auto exposure that lets users capture the highest quality images in any lighting scenario,” said the company. “Supporting two cameras up to 13MP each, the MediaTek Helio P25 redefines expectations for mobile photography and our multimedia features like, MediaTek MiraVision technology, continuously enhance visual user-experiences.” MediaTek added. Smartphones powered by MediaTek Helio P25 chip are expected to be available in the first quarter of this year. Source
MediaTek has announced two new upgraded X20 series mobile processor — the Helio X23 and Helio X27, which are upgrade to X20 and X25 chips respectively boasting improvements in the performance, camera department as well as in power consumption. MediaTek says that the new chips should offer about 20 percent better performance than their predecessors deliver significant increases in web browsing and application launching speeds Both the new chip features Tri-Cluster deca-core architecture and MediaTek CorePilot 3.0 technology and are based on the 20nm production process. The deca-core setup on Helio X23 and X27 is comprised of 2 x ARM Cortex-A72 cores + 4 x ARM Cortex-A53 cores + 4 x ARM Cortex A-53 cores. They support 2 x LPDDR3 800MHz RAM with support for up to 4GB RAM and the graphics is handled by ARM's Mali T880 MP4 GPU. They also support Full HD 1920 x 1080 pixels and WQXGA 2560 x 1600 pixel resolutions, H.265 video encoding with HDR support, Cat.6 LTE modem, WiFi 802.11ac, GPS/GLONASS/Beidu, Bluetooth and FM receiver. In terms of photography, both chips support dual-cameras with Imagiq image signal-processing solution. With Imagiq ISP, they should produce photos with better clarity, saturation, exposure control, portrait performance and more. Both chips are equipped with MiraVision EnergySmart Screen power-saving technology, that should deliver up to 25 percent reduction in display power consumption. The Envelope Tracking module will reduce power consumption during peak output by 15 percent. MediaTek says that smartphones powered by MediaTek Helio X23 and X27 will be available soon. Source
Chip maker MediaTek back in September introduced the Helio P25 SoC along with Helio X30, which will be used in new smartphones from next year. The Helio P25 is an upgraded version of Helio P20 and uses the same 16nm TSM process, but has slightly higher clock speed. Now details about MediaTek P35 SoC have been leaked, which will be used in mid-range smartphones priced between $150 and $$300 next year. According to the leak, the Helio P35 will be built using the more efficient 10nm TSMC process and will have deca-core CPUs, similar to Helio X30 (2 x Cortex A73 + 4 x Cortex A53 + 4 X Cortex A35), but with slightly lower clock speed. As for graphics the Helio P35 will be paired with ARM's Mali G71 MP3 GPU found on Helio X20. The chip will support up to 1080p display resolution, 2 x LPDDR RAM, UFS 2.1 storage, Cat. 10 LTE connectivity and Pump Express 3.0 fast charging technology. It is expected to arrive some in Q3 2017, and is MediaTek's answer to Qualcomm's upcoming Snapdragon 660 SoC, which was leaked recently. Via
MediaTek has officially announced Helio X30 SoC, which will be used by mid-range flagship devices to be released in future. The company had already revealed that Helio X30 SoC is built on a more efficient 10nm process and has a total of 10 CPU cores. Now MediaTek has provided more details on how the Helio X30 SoC differs from X20 SoC. The new chip has faster CPU cores, support for more memory, faster storage, high-res cameras, new GPU and better modem. Helio X30 offers 43 percent better performance and 53 percent improved power savings when compared with it's predecessor X20. The Helio X30 has a tri-clustur architecture with 2 x 2.8GHz Cortex A73 cores, 4 x 2.2GHz Cortex-A53 cores and 4 x 2GHz Cortex A35 cores. As for the GPU, the Helio X30 SoC has the PowerVR 7XTP-MT4 clocked at 850MHz. It also supports LPDDR4x RAM up to 8GB, 4K video capture @30fps, LTE Cat 10 modem and up to 28MP dual ISPs. MediaTek also unveiled the P25, an upgraded Helio P20 SoC, that was introduced back in Februrary this year. It uses that same 16nm TSMC process and octa-core CPUs as P20, but will be clocked slightly faster. Rest of the specs might be similar to P20 SoC including support for LPDDR4x RAM up to 6GB. It will also support dual cameras with optical zoom and offer better image processing. MediaTek expects to begin the mass production of Helio X30 sometime in first half of 2017. Via 1 | 2
Last year MediaTek unveiled the Helio X20 SoC with deca-core CPU, the world's first chipset to have tri-cluster CPU architecture, and earlier this year announced Helio X25 SoC, an upgraded version of Helio X20. Now the chipmaker has announced0 the Helio X30 chipset. Similar to Helio X20, the X30 SoC packs a deca-core CPU and a tri-cluster design, but is built using TSMC's 10nm FinFET processor. For reference the Helio X20/X25 was built using 20nm manufacturing process. The Helio X30 features 10-core CPU with 4 x Cortex A-73 cores running at 2.8GHz to handle heavy tasks, 4 x Cortex A53 clusters at 2.2GHz and 2 x Cortex A35 cores running at 2GHz. It comes with PowerVR 7XT GPU for graphics processing which is likely to be compatible with VR devices, supports up to 8GB RAM (2 x LPDDR4 POP 1600MHz channels) and comes with a modem that supports LTE Cat. 12 connectivity and three carrier aggregation. For imaging, Helio X30 supports up to 40MP camera sensor, and video recording up to 24MP. A 16MP camera will be capable of recording videos up to 60fps, while 8MP camera will support up to 120fps video recording. Devices powered by Helio X30 SoC are expected to hit the market during second of 2017. Via
MediaTek at an event in China officially introduced its Deca-core Helio X20 processor. Also at the event Meizu CEO, Yongxiang BAI and MediaTek VP & Co-COO, Jeffery Ju announced that Meizu's upcoming flagship, the Meizu Pro 6 will be exclusively powered by a Deca-core Helio X25 processor. The Helio X25 uses a similar architecture as the Helio X20 and has three cluster designs that includes 4 x Cortex A53 cores, 4 x Cortex A53 cores and 2 x Cortex A72 performance cores, but the chip is clocked at a higher speed of 2.5GHz. The Mali T880 GPU clock speed has also increased up to 850MHz. Although the clock speeds are higher, the X25 will consumer same amount of power as X20.
To recall the Helio X20 has 2 x ARM Cortx A72 CPUs clocked at 2.3GHz, 4 x
ARM Cortex A53 CPUs clokced at 2GHz, and 4 x A53 CPUs at 1.4GHz. The
Helio X20 SoC is coupled with Mali T880 GPU, supports up to WQXGA (2560 x
1600) display and up to dual 25MP ISPs, and supports MediaTek's Pump
Express+ 3.0 fast charging. The MediaTek X20 SoC is already utilized by ZOPO's Speed 8 that was introduced at MWC 2016.
Coming back to Helio X25 SoC, the processor will be exclusive to Meizu PRO 6 for few months, but the
official announcement of the phone is yet to be revealed. The Pro 6 was earlier rumored to feature Samsung's Exynos 8870 SoCs, but the MediaTek and Meizu's announcement proves it wrong. Other Meizu Pro 6 specifications rumors include 6GB RAM, 128GB storage and 1080p display with 3D/Force Touch technology. It is also expected to have Hi-Fi 3.0 sound and will run Meizu's custon Flyme 6.0 OS. Via
MediaTek at MWC 2016, besides introducing the MT2511 bio- sensor for health and fitness devices, has also announced its second gen P series mobile processor Helio P20, aimed at sub flagship smartphones. The chip maker claims that the power consumption of P20 is reduced by 25 percent, as compared with the Helio P10.
The Helio P20 is built on TSMC's 16nm FinFET Plus (16FF+) process, and houses an octa-core Cortex A53 CPU, with a clock speed of up to 2.3GHz. The GPU (graphic processing unit) is the Mali T800 clocked at 900MHz. MediaTek claims that Helio P20 is the industry's first mobile processor to to support
Samsung's LPDDR4X RAM module, offering 70 percent more bandwidth and almost 50 percent power saving, as compared with LPDDR3. This means means smoother application usage and transitions.
The chip supports WorldMode LTE Category 6 and
2x20 carrier aggregation at up to 300Mbps download speeds, and 50Mbps
upload speeds. It also supports global dual-SIM dual standby and LTE multimedia broadcast and multicast service, a feature that allows mobile devices to receive 720p video content over LTE.
Other features include Imagiq Image Signal Processor (offers enhanced media capture and playback), support for up to two 1080p displays at 60fps, 4K Video decoding and support for a single 24-megapixel camera or dual 13-megpixel camera.
The MediaTek Helio P20 is expected to be in commercial devices in the second quarter of 2016.
Health tracking is playing an important role in the evolution of wearables, and chipset makers, are now making dedicated chips for sensing medical parameters. Following the trend, MediaTek has announced the MT2511 chip, the chip makers first bio-sensing, analog front end chip (AFE) designed for health and fitness devices.
The MT2511 is capable of measuring bio-parameters such as electrocardiography (ECG) and photopletysmography (PPG), and measure heart beat intervals as well. It is equipped with 4KB SRAM, to optimize the system's overall power consumption for sleep heart rate monitoring. It supports SPI/I2C connectivity and has an integrated LED driver boost
circuit for saving layout space.
The chip is also able to measure, blood pressure, pulse oximetry (SpO2 levels), electromyography (EMG) and electroencephalography (EEG). As it supports a high accuracy range greater than 100dB, it eliminated interference when collecting the heart's electric signals.
The
MT2511 can be paired with, MediaTek's existing IOT and wearables
platforms including MT2502, MT2523 and MT2601 to establish a medically
accurate, bio-parameter collection sensor chipset. . The MediaTek MT2511
is expected to be mass manufactured by the end H1 2016.
Taiwan based chip maker, MediaTek will be bringing three new chipsets, with the aim to improve the low-cost, mid-range Android handsets market. The three new chipsets - MT6738, MT6750, MT6750T feature 64-bit architecture and each of them are LTE ready for future low budget smartphone.
The MT6738 is the least expensive of the three chips and comes with four ARM Cortex-A53 chips clocked at 1.5GHz with Mali T860 MP1 GPU. It supports screen resolution of up to 720p, up to 4GB RAM and 13-megapixel camera along with Cat.6 LTE support. The MT6750 houses a total of eight cores, four clocked at 1.5GHz and the other four at 1.0GHz. The GPU on the chipset is Mali T860 MP2 and screen resolution is capped at 720p. It supports up to 4GB RAM and the camera support is up to 16-megapixel. The MT6750T offers the same configuration as the MT6750 but supports 1080p display.
The SoCs are expected to be available to device makers sometime in February, and if things move along as planned, they should start appearing in budget LTE handsets by June-July. Via
Micromax has partnered with MediaTek to launch mid-to-premium 4G LTE smartphone powered by MT6735 and Helio X10 SoC. The company also introduced the first MediaTek powered Micromax phone dubbed Canvas Fire 4G. Micromax Canvas Fire 4G features 4.5-inch display with 854 x 480 pixels resolution and is powered by 1GHz quad-core MediaTek MT6736M 64-bit processor aided by 1GB RAM. On-board storage is 8GB, which can be expandable via microSD card. It runs Android 5.1 Lollipop.
For imaging, there is 5-megapixel rear camera with LED flash and 2-megapixel front shooter. It is fueled by 1850mAh battery and comes with dual front firing speakers for an immersive media experience. The phone supports Indian 4G LTE bands including TDD-LTE band 40 and FDD-LTE band 3.
Micromax has not revealed the pricing and availability details of the Canvas Fire 4G. Commenting
on the launch, Vineet Taneja, CEO, Micromax Informatics said, "We have
always endeavoured to offer products based on certain needs of the
consumer. Moving forward, we will lead the 4G adoption in the country by
converting all our popular value Canvas series to 4G. Canvas Fire 4G is
the first in a series of such launches."
Finbarr Moynihan,
General Manager of International Sales, MediaTek said, "With MediaTek's
wide portfolio of LTE products from entry to premium, we have the right
business and technology strategy, along with local collaborations to
make LTE a reality for Indian consumers. The technology is going to
change to higher speeds and networks and MediaTek is pleased to
collaborate with Micromax Informatics to deliver a stable and affordable
4G handset experience."
MediaTek announced the launch of Helio X20 SoC for smartphone and tablet. The company claims that it is the world's first processor with 10 processing cores (Deca-core) and tri-cluster CPU design. For the very first time we are seeing such an architecture on a chipset.The Helio X20 consists of three processor cluster, each designed to handle different types of work loads. It consists of one cluster of two ARM Cortex-A72 cores (clocked at 2.4GHz for exterme performance) and two cluster of four ARM Cortex-A53 cores (one clocked at 2GHZ for medium loads and the other 1.4GHz for light activities).
The company says that dividing the cores into three clusters provides more efficient allocation of tasks for smoother performance and extended battery life. "Innovative three cluster architecture sets
new performance and power efficiency benchmarks with up to a 30%
reduction in power consumption for the next generation of mobile device"
The Helio X20 is most likely to comes with Mali T800 series GPU and for memory chip it comes with two LPDDR3 Memory running at 933MHz. It features support for smartphone and tablet displays with 120Hz refresh rate. It also supports 32-megapixel single camera with 24fps and 25-megapixel camera with 30fps. The processor packs 3D depth engine built into the hardware and includes new de-noise and demosaic hardware for improved image quality, color accuracy and sharpness under extreme conditions. There is also support for 10-bit color depth and both HEVC, VP9 HW decoding.
It also features an integrated lower power ARM Cortex-M4 processor to support always-on applications such as MP3 playback and voice activation. The sensor hub operates on a lower power domain for better battery efficiency. The Helio X20 processor will begin sampling Q3, this year and can be
expected to be available in consumer products by end of this year.
